A desktop 3D printer with one of the largest workspaces among Plug & Play devices able to 3D print big models in one go
- Large workspace 300 x 300 x 300 mm is enough to print large models at once
- Wi-Fi and Ethernet connection
can be connected in large networks with Wi-Fi or Ethernet. Models can also be loaded directly from a USB storage device to each of the printers. Keep an eye on the 3D printing process with a camera built into the printing chamber
- Filament sensor, automatically enters pause mode when there is no more filament left
- Improved extruder and nozzle
- No assembly is required before starting work. You can select available options and view 3D models directly on the intuitive built-in touchscreen. Automatic firmware updates via WLAN bring all future functions directly to the printer.
- Key features of Z-SUITE 2, is a slicing application that also functions as a wireless command centre for intelligent, with Wi-Fi connectivity.
- Supported filaments, The improved extruder also allows you to print 3D with more experimental and flexible filaments.
| Build volume | 300 x 300 x 300 mm (11.8 x 11.8 x 11.8 in) |
|---|---|
| Material container | Spool |
| Material diameter | 1,75 mm (0.069 in) |
| Nozzle diameter | 0,4 mm (0.016 in) |
| Support | Mechanically removed – printed with the same material as the model |
| Extruder | Single (upgraded for more demanding materials) |
| Extruder cooling system | Radial fan cooling the extruder block |
| Hotend | Redesigned (v3), new geometry of the nozzle |
| Platform | Perforated, heated |
| Material endstop | Mechanical |
| Connectivity | WI-FI, USB, Ethernet |
| Operating system | Android |
| Processor | Quad Core |
| Touchscreen | 4” IPS 800 x 480 |
| Camera | Yes |
| Available materials | Z-ULTRAT, Z-HIPS, Z-GLASS, Z-PETG, Z-ESD, Z-ASA Pro, Z-PLA Pro |
| External materials | Applicable |
| Weight | 55 kg |
| In the box | 3D printer, Hotend V3, Side Covers, Z-SUITE, Starter Kit, 2 spools of material, Spoolholder |
| Printing | |
| Technology | LPD (Layer Plastic Deposition) – depositing melted material layer by layer onto the build platform |
| Layer resolution | 90-290 microns |
| Minimal wall thickness | 400 microns |
| Platform levelling Automatic measurement of platform points’ height | |
| Maximum platform temperature | 105 ˚C (221 °F) |
| Maximum printing temperature (extruder) | 290 ˚C (554 °F) |
| Ambient operation temperature | 20 – 30 ˚C (68 – 86 °F) |
| Storage temperature | 0 – 35 ˚C (32 – 95 ˚F) |
| AC input | 110 V ~ 5.9 A 50/60 Hz 240 V ~ 2.5A 50/60 Hz |
| Maximum power consumption | 360 W |
| Weight | 55 KG |
| Code | 3D-01-0004 |
| ID | 2432458 |